High-density compute servers are high-value, precise and heavy, and highly sensitive to impact, static, temperature/humidity and transport conditions; traditional packaging struggles to balance protection and delivery efficiency.
GPU modules, motherboards and storage are highly sensitive to impact and vibration; a single knock can cause failure and data risk.
Chips and electronic components are prone to electrostatic damage and need anti-static shielding throughout to avoid irreversible hidden damage.
Each unit is high-value and heavy, concentrating risk during secondary handling and stacking.
Moisture and condensation can cause short circuits and oxidation; long sea voyages pose tough temperature/humidity challenges.
Rack structures are complex with dense interfaces, making firm support and even loading throughout difficult.
Export transport and environmental rules vary widely; packaging must be localized and compliant.
From requirement discussion to logistics delivery, a six-step standardized process ensures precise execution and full traceability.
Six protective layers, four base materials and four standard tests deliver a complete compute-server packaging solution.
Item to pack · High-density compute server
Shock, drop and static protection; a multi-layer structure safeguards equipment in transit.
Lightweight design and optimized volume reduce transport and storage costs.
Recyclable materials, RoHS compliant and reusable.
Standardized design adapted to global logistics, with localized packaging services.
